Dr. Sridhar Canumalla is a Principal Engineer with Microsoft in the Entertainment and Devices division. He is involved in failure analysis and reliability improvement of hardware consumer electronic products. Prior to joining Microsoft, he worked at Texas Instruments as Package Development Reliability Engineer, where he was involved inflip chip and wire bond IC package development projects for consumer electronics applications as reliability engineer. He has also worked at Nokia R&D as Senior Specialist. While at Nokia, he was involved in the development of several mobile phone products. He was responsible for Reliability Testing and Failure Analysis lab management. Sridhar has also served as Staff Scientist at Sonoscan Inc., where he was responsible for advancing acoustic microscopy techniques in microelectronic failure analysis. Sridhar received his Doctorate of Philosophy degree in Engineering Science and Mechanics from The Pennsylvania State University in 1995 for his work on understanding the fatigue and fracture behavior of metal matrix composites using destructive and nondestructive characterization techniques and mechanics. He was awarded the 1st prize in the Graduate Research Exhibition in 1990 along with his partner Stephen Dynan, and is a member of Tau Beta Pi engineering honor society. He also has a Bachelor degree in Mechanical Engineering from the Jawaharlal Nehru Technological University, Hyderabad.Sridhar has over 40 technical publications in journals and conference proceedings in the areas of IC packaging, reliability engineering and testing, robust design, solders, acoustic microscopy, acoustic emission, materials characterization, fatigue and fracture, and processing of composite materials. He has also published papers in the areas of corrosion and renewable energy and holds one patent. He is a Senior Member of IEEE Components, Packaging and Manufacturing Technology Society and a regular reviewer for IEEE Journals. He is active in the Applied Reliability subcommittee of the Electronic Components and Technologies Conference, and is a past chair.
Dr. Puligandla Viswanadham recently retired from Nokia Research Center, Irving Texas as Principal Scientist and was involved in second level electronic packaging that included reworkableunderfills, chip scale packaging, lead(Pb)- free solders and reliability investigations. Prior to joining Nokia he worked as Senior Member of the Technical Staff at Raytheon TI Systems and Texas Instruments and was involved in the Ball Grid Array and Chip Scale Package technology assembly development and implementation, and at IBM as an Advisory Scientist in Rochester MN, Endicott N.Y. and Austin Texas facilities. At IBM Viswanadham was involved in the process development and qualification of Surface laminar Circuitry, Assembly and Reliability of Fine Pitch Quad Flat Packs, Thin Small Outline Packages, Tape Automated Bonding, and Area Array technologies. Also, while at IBM Austin he was manager of site Analytical Laboratories during 1989-90. As a member of the Materials and Process Engineering group at IBM Rochester Viswanadham was involved in corrosion studies, analytical methods development, plating studies and contamination control. Prior to joining IBM, his research activities included high temperature chemistry and thermodynamics of binary and ternary chalcogenides, atomic absorption, slag-seed eqilibria in coal fired magneto-hydrodynamics energy generation, and astrophysics. During 1959-68 he worked as Senior Research Assistant at the Astrophysical Observatory and India Meteorological Department. Viswanadham authored or co-authored well over 130 technical publications in journals, symposium proceedings and trade magazines. He is the co-author of the book titled Failure Modes and Mechanisms in Electronic Packages published by Chapman and Hall in 1998. He also authored or coauthored nine book chapters in the areas of microelectronic packaging, fine pitch surface mount technology, ball grid array technology, chip scale packaging, corrosion in microelectronics, reliability of portable electronics, etc. He received the First, Second and Third plateau IBM invention achievement awards for several of his patents and invention disclosures, and an IBM excellence award. He also received fourth level IBM Technical Author Recognition Award for his publications. During 1974-78 he was on the faculty of Ohio Dominican College Columbus, OH.as Assistant Professor and taught chemistry, and physics Puligandla Viswanadham has a PhD degree in Chemistry from University of Toledo, Toledo, OH, an M.Sc., degree in chemistry from Saugor University, Saugor, India, and a B.Sc., degree in chemistry from Sri Venkateswara University, India. He is a member of the Surface Mount Technology association and served as a member of Board of Directors, Technical Committee, and is currently on the journal review committee. He has given several professional development courses and tutorials at SMTA, IPC, and IMAPS technical conferences His current institutional affiliation is Mechanical and Aerospace engineering, University of Texas at Arlington Texas as an adjunct staff teaching Failure Modes and Mechanisms in Electronic Packages and Chip Scale packaging. He is also currently involved in the preparation of a book on the fundamentals and essentials of electronic packaging.
